Liquid jet head, liquid jet apparatus, and method for manufacturing liquid jet head
AssigneeSony Corporation
InventorsTakaaki Miyamoto, Minoru Kohno
Life of this patent
Estimating the term…
Abstract
To ensure satisfactory reliability even if the wiring pattern is formed of a wiring material having an enhanced electromigration resistance, by providing a protective layer for protecting heating elements from dry etching for forming a wiring pattern, on the ink chamber side or other liquid chamber side of each heating element.
Claims4
1-4. (canceled)
A method for manufacturing a liquid jet head discharging droplets from a desired nozzle by exciting a corresponding heating element disposed above a semiconductor substrate with a wiring pattern there between to generate heat so as to heat a liquid in a corresponding liquid chamber, the method comprising the steps of:
- forming the heating element of metal or a metallic compound above the semiconductor substrate;
- forming a protective layer for protecting the heating element from dry etching for forming the wiring pattern, on the surface on the liquid chamber side of the heating element;
- forming a wiring material layer of a wiring material for the wiring pattern, on the liquid chamber side of the protective layer;
- and
- dry-etching the wiring material layer to form the wiring pattern.
6-10. (canceled)
Dependencies are inferred from the claim text.