Back to results
US 2006/0048932 A1Published application
Configurable heat sink
OwnerBrandon Rubenstein, Stephan Barsun +4inventors
InventorsBrandon Rubenstein, Stephan Barsun, Christian Belady, Gregory Huff, Christopher Malone, Roy Zeighami
Life of this patent
Estimating the term…
Abstract
Systems, methodologies, media, and other embodiments associated with a configurable heat sink are described. One exemplary system embodiment includes a base portion of a heat sink to which different accessories may be removably attached. The example system may include a first accessory like a cover that forms an assembly with the base portion of the heat sink and causes the assembly to operate in a first manner.
Claims34
A configurable heat sink apparatus, comprising:
- a base having a first surface and one or more second surfaces, the first surface being configured to be positioned in contact with a heat source, the one or more second surfaces being configured with one or more apertures, and the base including a heat dissipation apparatus configured to dissipate heat from the heat source;
- and
- one or more accessories that are removably attachable to the one or more second surfaces, the one or more accessories being configured to be positioned over at least a portion of one or more of the one or more apertures, the one or more accessories being configured to control, at least in part, the flow of one or more mediums experienced by the heat dissipation apparatus.
A user configurable heat sink, comprising:
- a base having a first surface and one or more second surfaces, the first surface being configured to be positioned in contact with an integrated circuit, the one or more second surfaces being configured with one or more apertures, the base including a heat dissipation apparatus configured to dissipate heat from the integrated circuit;
- and
- one or more accessories including a cover, a fan, or a pump, that are removably attached to one or more of the one or more second surfaces, the one or more accessories being configured to be positioned over at least a portion of one or more of the one or more apertures, the one or more accessories being configurable to control, at least in part, a flow of one or more of, a gas, and a fluid in the heat dissipation apparatus.
A multi-directional flow heat sink assembly, comprising:
- a heat dissipation component configured to conduct heat away from a heat source to which the multi-directional flow sink assembly may be attached;
- and
- one or more flow components configured to influence a flow of a medium in the heat dissipation component, the one or more flow components being removably attachable to the multi-directional flow heat sink assembly.
A multi-directional flow heat sink assembly, comprising:
- a heat dissipation component configured to conduct heat away from a an integrated circuit to which the multi-directional flow sink assembly may be attached;
- and
- one or more of a cover, a gas moving fan, and a fluid moving pump that are removably attachable to the multi-directional flow heat sink assembly and that are configured to produce one or more of, an impinging flow in the heat dissipation component, and a straight-through flow in the heat dissipation component.
A processor assembly, comprising:
- a heat sink configured to be cooled by one of two or more air flows, the heat sink including a fin configured to dissipate heat;
- and
- a control element configured to control an air flow in an area of the processor assembly containing the fin.
A processor assembly, comprising:
- a heat sink configured to be cooled by a medium flowing in one of two or more configurations;
- and
- an apparatus configured to affect the flow configuration of the medium, the apparatus being attached to the heat sink, the apparatus being configurable to take on an open, active state and a closed, inactive state.
A heat dissipation apparatus, comprising:
- a heat sink configured to be cooled by one of two or more air flows;
- and
- a fan attached to the heat sink, the fan being configurable to take on an open, active state and a closed, inactive state, where the fan is configured to take on the open, active state when a cover attached to the fan is in an open position, and where the fan is configured to take on the closed, inactive state when the cover is in a closed position;
- and
- where the heat sink is cooled by an impinging air flow when the fan is configured in the open, active state and the heat sink is cooled by a straight-through air flow when the fan is configured in the closed, inactive state.
2 more elements
A computer executable method, comprising:
- identifying a heat source for which heat dissipation is desired;
- producing a heat sink assembly configured to provide heat dissipation for the heat source, where the heat sink assembly includes a configurable heat sink and two or more accessories that are removably attachable to the heat sink assembly;
- and
- providing the heat sink assembly as a single part.
1 more element
A system, comprising:
- means for dissipating heat from an integrated circuit;
- first means for altering an airflow through the means for dissipating heat, where the first means are swappable with second means for altering the airflow through the means for dissipating heat;
- and
- means for removably attaching the first and second means for altering the airflow to the means for dissipating heat.
1 more element
A method for removing heat from a heat source, comprising:
- providing a configurable heat sink assembly having an interface surface, a heat dissipation apparatus, and one or more accessories configurable to control an air flow in the area of the heat dissipation apparatus;
- configuring the configurable heat sink assembly by manipulating one or more of the one or more accessories;
- contacting the heat source with the interface surface;
- and
- causing a first air flow in the area of the heat dissipation apparatus, where the first air flow is controlled, at least in part, by the one or more accessories.
2 more elements
Dependencies are inferred from the claim text.