Tungsten plug corrosion prevention method using gas sparged water
OwnerJohn Jacobs, Elizabeth Dauchinventors
Life of this patent
Estimating the term…
Abstract
Disclosed herein is a method of making integrated circuits. In one embodiment the method includes forming tungsten plugs in a integrated circuit and forming electrically conductive interconnect lines after formation of the tungsten plugs, wherein at least one tungsten plug is electrically connected to at least one electrically conductive interconnect line. Separate from the formation of the tungsten plugs and electrically conductive interconnect lines, a gas is introduced into a liquid. At least one electrically conductive interconnect line is then contacted with the gas introduced liquid.
Claims13
1-20. (canceled)
An apparatus comprising:
- a first chamber for receiving a gas;
- a second chamber for receiving a liquid;
- a porous membrane separating the first and second chambers, wherein the porous membrane is configured to pass the gas from the first chamber into the second chamber so that the gas can dissolve into the liquid;
- a tube coupled between the second chamber and a nozzle, wherein the tube is configured to transmit the liquid with the gas dissolved therein;
- a substrate comprising:
- a tungsten plug formed in a dielectric layer, and;
- an electrically conductive interconnect line formed on the dielectric layer, wherein the tungsten plug is electrically connected to the electrically conductive interconnect line;
- wherein the substrate is positioned relative to the nozzle so that the liquid, with the gas dissolved therein, transmitted through the tube and nozzle emerges from the nozzle and contacts the electrically conductive interconnect line.
An apparatus comprising:
- a chamber in which in which a gas can be introduced into a liquid to produce a gas sparged liquid;
- a device coupled to the chamber, wherein the device is configured to output gas sparged liquid produced in the chamber;
- a substrate comprising:
- a tungsten plug formed in a dielectric layer, and;
- an electrically conductive interconnect line formed on the dielectric layer, wherein the tungsten plug is electrically connected to the electrically conductive interconnect line;
- wherein the substrate is positioned relative to the device so that gas sparged liquid outputted by the device contacts the electrically conductive interconnect line.
An apparatus comprising:
- a chamber for dissolving a gas into a liquid;
- a device coupled to the chamber, wherein the device is configured to output the liquid with the gas dissolved therein;
- a substrate comprising:
- a tungsten plug formed in a dielectric layer, and;
- an electrically conductive interconnect line formed on the dielectric layer, wherein the tungsten plug is electrically connected to the electrically conductive interconnect line;
- wherein the substrate is positioned relative to the device so that the liquid, with the gas dissolved therein, outputted from the device, contacts the electrically conductive interconnect line.
Dependencies are inferred from the claim text.