Cleaning liquid and cleaning method
AssigneeMitsubishi Gas Chemical Company, Inc.
InventorsKenji Shimada, Kojiro Abe, Masaru Ohto, Hiroshi Matsunaga
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Abstract
A cleaning liquid is provided, which comprises an aqueous solution containing nitric acid, sulfuric acid, a fluorine compound, and a basic compound. The concentration of water in the cleaning liquid is 80% by weight or more, and the pH value of the cleaning liquid is from 1 to less than 3. The cleaning liquid is effective for removing etching residues formed in a dry etching process from semiconductor devices and display devices without oxidizing and corroding their metal wirings, particularly, copper wirings and the materials of insulating films.
Claims10
A cleaning liquid for semiconductor devices and display devices having metal wirings, which is an aqueous solution containing nitric acid, sulfuric acid, a fluorine compound, and a basic compound, wherein a content of water is 80% by weight or more of the cleaning liquid and a pH value of the cleaning liquid is form 1 to less than 3.
Dependencies are inferred from the claim text.