US 2006/0040094 A1 · Electronic parts board and method of producing the same

Abstract

An electronic component substrate 1-1 includes an insulating base 10 and a flexible circuit board 20 mounted on the insulating base 10. The flexible circuit board 20 is a synthetic resin film provided thereon with terminal patterns 29 and a conductor pattern 25 whose surface is slidingly contacted with a slider. The insulating base 10 is a synthetic resin molded piece. The flexible circuit board 20 is insert-molded to the insulating base 10. The electronic component substrate 1-1 is produced by preparing the flexible circuit board 20 and first and second mold members 41 and 45 having a cavity C1 with a shape that corresponds to the external shape of the electronic component substrate 1-1. Then, the flexible circuit board 20 is accommodated in the cavity C1 between the first and second mold members 41 and 45, and a molten molding resin is filled into the cavity C1. After the filled molding resin has been solidified, the first and second mold members 41 and 45 are removed.

Claims16

Dependent claims

A substrate for an electronic component, comprising:

an insulating base;
and
a flexible circuit board mounted on said insulating base, said flexible circuit board being a synthetic resin film provided thereon with terminal patterns and a conductor pattern whose surface is slidingly contacted with a slider;
wherein said insulating base is a synthetic resin molded piece, and said flexible circuit board is insert-molded to said insulating base.

1 more element

A method of producing an electronic component substrate, comprising:

preparing a flexible circuit board comprising a synthetic resin film provided thereon with a conductor pattern, a surface of which is slidingly contacted with a slider, and terminal patterns connected to said conductor pattern, and further preparing a mold having a cavity with a shape that corresponds to an external shape of said electronic component substrate to be produced;
accommodating said flexible circuit board in the cavity of said mold in such a manner that a surface of said flexible circuit board where the conductor pattern is provided is abutted against one inner surface of the cavity, and a portion of said flexible circuit board on a side thereof where the terminal patterns are provided is folded over toward the other inner surface of the cavity;
filling a molten molding resin into said cavity, thereby bringing the folded portion of said flexible circuit board into close contact with a cavity wall area extending from an upper surface to a lower surface of the cavity along one outer peripheral side surface thereof;
and
removing the mold after the filled molding resin has been solidified, whereby the flexible circuit board is mounted on an insulating base made of the molding resin in such a way that a portion of said flexible circuit board where the conductor pattern is provided is exposed on an upper side of said insulating base, and a portion of said flexible circuit board on the side thereof where the terminal patterns are provided is exposed in a folded state over an area extending from one outer peripheral side to a lower side of said insulating base.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application

10/541,459Filed 5 Feb 2004

Priority

JP 2003-3418012 Feb 2003

Published

23 Feb 2006

Term ends

Not estimatedThe source records don’t support an estimate.

Classification17 codes

B29C 45/1418
Incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles: the inserts being deformed or preformed,…
B29C 45/14639
Incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles: for obtaining an insulating effect, e.g.…
H01C 10/32
The contact sliding along resistive element: the contact moving in an arcuate path
H01C 10/48
Arrangements of fixed resistors with intervening connectors, e.g. taps: including contact movable in an arcuate path

Electronic parts board and method of producing the same

Life of this patent

Electronic parts board and method of producing the same

Life of this patent

Abstract

Claims16