Methods of forming material on a substrate, and a method of forming a field effect transistor gate oxide on a substrate
AssigneeMicron Technology, Inc.
InventorGurtej Sandhu
Life of this patent
Estimating the term…
Loading patent…
AssigneeMicron Technology, Inc.
InventorGurtej Sandhu
Estimating the term…
The invention includes methods of forming material on a substrate and methods of forming a field effect transistor gate oxide. In one implementation, a first species monolayer is chemisorbed onto a substrate within a chamber from a gaseous first precursor. The first species monolayer is discontinuously formed over the substrate. The substrate having the discontinuous first species monolayer is exposed to a gaseous second precursor different from the first precursor effective to react with the first species to form a second species monolayer, and effective to form a reaction product of the second precursor with substrate material not covered by the first species monolayer. The substrate having the second species monolayer and the reaction product is exposed to a third gaseous substance different from the first and second precursors effective to selectively remove the reaction product from the substrate relative to the second species monolayer. Other implementations are contemplated.
1-18. (canceled)
A method of forming a field effect transistor gate oxide on a substrate, comprising:
28-43. (canceled)
Dependencies are inferred from the claim text.