Optoelectronic conversion header, LSI package with interface module, method of manufacturing optoelectronic conversion header, and optical interconnection system

An optoelectronic conversion header comprising:

• an optical semiconductor device having an device surface in which a surface light emitter or a surface photo detector is formed;
• an optical waveguide having an end face, which guides an optical signal, the optical signal being transferred along a transfer direction between the device surface and the end face;
• a ferrule having a mounting surface on which the optical semiconductor device is mounted and a side surface crossing the mounting surface, which holds the optical waveguide so as to face the end face of the optical waveguide to the device surface of the optical semiconductor device at the mounting surface, the end face being substantially vertical to the transfer direction and the device surface being deviated two degrees or more from a plane vertical to the transferred direction;
• and
• an electric wire provided on the ferrule, extending from the side surface to the mounting surface and electrically connected to the device surface;
• and
• a first transparent resin provided between the end face of the optical waveguide and the device surface of the optical semiconductor device.

An LSI package to be mounted on a printed wiring board comprising:

• an interposer equipped with a signal processing LSI and having first electric terminals to be electrically connected to the printed wiring board;
• an interface module including an optoelectronic conversion header and an electrical connection terminal, which is electrically and mechanically connectable to the interposer, the optoelectronic conversion header comprising:
• an optical waveguide which guides an optical signal and serves as an optical transmission channel for the optical signal and has an end face;
• a ferrule, having a mounting surface, which holds the optical waveguide in a predetermined position so that the end face of the optical waveguide protrudes from the mounting surface;
• an electric wire provided on the mounting surface of the ferrule;
• and
• an optoelectronic converter having a optical input/output surface, which is electrically connected to the electric wire and is mounted on the mounting surface of the ferrule, the optical input/output surface being faced to the end face of the optical waveguide so as to transfer the optical signal along a transfer direction between the optical input/output surface and the end face of the optical waveguide, the end face being substantially vertical to the transfer direction;
• and the optical input/output surface being deviated two degrees or more from a plane vertical to the transfer direction

An LSI package to be mounted on a printed wiring board comprising:

• an interposer equipped with a signal processing LSI and having connecting electric terminals to be electrically connected to a printed wiring board;
• an interface module including an optoelectronic conversion header and an electrical connection terminal, which is electrically and mechanically connects to the interposer, the optoelectronic conversion header comprising:
• an optical semiconductor device having an device surface in which a surface light emitter or a surface photo detector is formed;
• an optical waveguide having an end face, which guides a optical signal and serves as an optical transmission channel for the optical signal, the optical signal being transferred along a transfer direction between the device surface and the end face;
• a ferrule having a mounting surface on which the optical semiconductor device is mounted and a side surface crossing the mounting surface, the ferrule holding the optical waveguide so as to face the end face of the optical waveguide to the device surface of the optical semiconductor device at the mounting surface, the end face being substantially vertical to the transfer direction and the device surface being deviated two degrees or more from a plane vertical to the transferred direction;
• and
• an electric wire provided on the ferrule, extending from the side surface to the mounting surface and electrically connected to the device surface;
• and
• a first transparent resin provided between the end face of the optical waveguide and the device surface of the optical semiconductor device.

A method of manufacturing an optoelectronic conversion header, the method comprising:

• mounting an optical semiconductor device having a rear surface and an device surface in which a surface light emitter or a surface photo detector is formed, on an mounting surface of a ferrule, and electrically connecting the optical semiconductor device to an electric wire on the ferrule, the ferrule having a mounting surface and a insertion hole for holding the optical waveguide;
• disposing a stopper member having a surface substantially parallel to the rear surface of the optical semiconductor device on the rear surface;
• and
• inserting the optical waveguide into the insertion hole so as to face an end face of the optical waveguide to the device surface of the optical semiconductor device, the end face of the optical waveguide being substantially vertical to a transfer direction of a optical signal guided by the optical waveguide between the end face and the device surface, and the device surface being inclined to a plane vertical to the transferred direction, and putting a transparent resin between the device surface and the end face while the stopper member is disposed on the rear surface of the optical semiconductor device.

An optical interconnection system comprising:

• an optical waveguide which guides an optical signal and has first and second end faces optically coupled to each other;
• first and second optoelectronic conversion headers optically coupled by the optical waveguide, the first optoelectronic conversion header comprising:
• a first ferrule, having a first mounting surface, which holds the optical waveguide in a first predetermined position so that the first end face of the optical waveguide protrudes from the first mounting surface;
• an first electric wire provided on the first mounting surface of the first ferrule;
• and
• a light emitting device having a light emitting surface, which is electrically connected to the first electric wire and is mounted on the first mounting surface of the first ferrule, the light emitting surface being faced to the first end face of the optical waveguide so as to transfer the optical signal along a first transfer direction from the light emitting surface to the first end face of the optical waveguide, the first end face being substantially vertical to the transfer direction;
• and the light emitting surface being deviated two degrees or more from a plane vertical to the transfer direction;
• and
• the second optoelectronic conversion header comprising:
• a second ferrule, having a second mounting surface, which holds the optical waveguide in a second predetermined position so that the second end face of the optical waveguide protrudes from the second mounting surface;
• an second electric wire provided on the second mounting surface of the second ferrule;
• and
• a photo-detecting device having a photo-detecting surface, which is electrically connected to the second electric wire and is mounted on the second mounting surface of the second ferrule, the photo-detecting surface being faced to the second end face of the optical waveguide so as to transfer the optical signal along a second transfer direction from the second end face of the optical waveguide to the photo-detecting surface, the second end face being substantially vertical to the transfer direction;
• and the detecting surface being deviated two degrees or more from a plane vertical to the transfer direction.