US 2006/0038304 A1 · Conductive adhesive agent and process for manufacturing article using the conductive adhesive agent

Abstract

The present invention provides a conductive adhesive agent capable of being diluted with a solvent to give good coating workability and allowing formation of a conductive joint excellent in both thermal conductivity and electrical conductivity by inhibiting a gas generated when a binder resin is heat-cured after attachment of a part. The conductive adhesive agent according to the present invention is a conductive adhesive agent wherein, based on 100 parts by weight of silver powder having an average particle diameter of micrometers, which is used for a conductive medium, e.g. as a main component, 1 to 10 parts by weight of silver fine particles having an average particle diameter of nanometers is used in combination therewith and 5 to 15 parts by weight of thermosetting resin as a binder resin component and 10 parts or less by weight of solvent for adjustment of a fluid viscosity are blended therein as essential components, and by selection of such a blending ratio, generation of a gas component during heating and curing of the thermosetting resin to prevent formation of voids, and at the same time, fabrication of a conductive joint excellent in thermal conductivity and electrical conductivity is achieved.

Claims12

Dependent claims

A conductive adhesive agent comprising, as major constituent parts, a metal component as a conductive medium and a thermosetting resin as an adhesive component,

wherein the conductive adhesive agent contains, as essential components thereof:
a metal powder (A) made of at least one metal material selected from the group consisting of silver, copper, gold, platinum, nickel, zinc, bismuth and tungsten, and having an average particle size selected to be in the range of 0.5 to 30 μm;
ultrafine particles (B) that are composed of ultrafine metal particles with an average particle size selected to be in the range of 1 to 20 nm made of at least one metal material selected from the group consisting of silver, copper, gold, platinum, nickel, zinc and bismuth, and a covering layer of an organic compound being formed on the metal surface thereof;
a thermosetting resin (C);
and
a solvent (D), and
the ratio of blended amounts of said essential components in the conductive adhesive agent is such that provided that the blended amount A of said metal powder is 100 parts by weight,
the blended amount B of said ultrafine particles is selected to be in the range of 1 to 10 parts by weight,
the blended amount C of said thermosetting resin is selected to be in the range of 5 to 15 parts by weight, and
the blended amount D of said solvent is selected to be 10 parts or less by weight.

7 more elements

A conductive adhesive agent comprising, as major constituent parts, a metal component as a conductive medium and a thermosetting resin as an adhesive component,

wherein the conductive adhesive agent contains, as essential components thereof:
a metal powder (A) made of at least one metal material selected from the group consisting of silver, copper, gold, platinum, nickel, zinc, bismuth and tungsten, and having an average particle size selected to be in the range of 0.5 to 30 μm;
ultrafine particles (B) that are composed of ultrafine metal particles with an average particle size selected to be in the range of 1 to 20 nm made of at least one metal material selected from the group consisting of silver, copper, gold, platinum, nickel, zinc and bismuth, and a covering layer of an organic compound being formed on the metal surface thereof;
a thermosetting resin (C);
and
a solvent (D), and
the ratio of blended amounts of said essential components in the conductive adhesive agent is such that the blended amount A of the metal powder is selected to be in the range of 74.0 parts by weight to 94.3 parts by weight,
the blended amount B of said ultrafine particles is selected to be in the range of 0.9 parts by weight to 8.7 parts by weight,
the blended amount C of said thermosetting resin is selected to be in the range of 4.0 parts by weight to 12.9 parts by weight, and
the blended amount D of said solvent is selected to be within 8.6 parts by weight.

7 more elements

Dependencies are inferred from the claim text.

Conductive adhesive agent and process for manufacturing article using the conductive adhesive agent

Life of this patent

Conductive adhesive agent and process for manufacturing article using the conductive adhesive agent

Life of this patent

Abstract

Claims12