US 2006/0038303 A1 · Etched interposer for integrated circuit devices

Abstract

In one embodiment, a package-to-package stack is assembled comprising a first integrated circuit package, and a second integrated circuit package which are mechanically and electrically connected using an interposer. In one embodiment, the interposer 106 includes columnar interconnects which may be fabricated by etching a conductive member such as copper foil, for example. In one application, the pitch or center to center spacing of the columnar interconnects may be defined by masking techniques to provide an interconnect pitch suitable for a particular application. In yet another aspect, etching rates may be controlled to provide height to width aspect ratios of the columnar interconnects which are suitable for various applications.

Claims35

Dependent claims

A method, comprising:

etching an electrically conductive member to form an interposer comprising a plurality of electrically conductive columnar interconnects defined by etched interstices between columnar interconnects wherein each columnar interconnect has a first end and a second end distal of said first end;
bonding said first end of each columnar interconnect to a conductive contact of a first element selected from a group consisting of an integrated circuit package, an integrated circuit die, a substrate for an integrated circuit;
and
bonding said second end of each columnar interconnect to a conductive contact of a second element selected from a group consisting of an integrated circuit package, an integrated circuit die, a substrate for an integrated circuit.

1 more element

Dependencies are inferred from the claim text.

Etched interposer for integrated circuit devices

Life of this patent

Etched interposer for integrated circuit devices

Life of this patent

Abstract

Claims35