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US 2006/0038301 A1Published application
Micro structure with interlock configuration
AssigneeYamaha Corporation
InventorTamito Suzuki
Life of this patent
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Abstract
A micro structure has: a semiconductor substrate; an insulating film having a via hole and formed on the semiconductor substrate; an interlock structure formed on a side wall of the via hole and having a retracted portion and a protruded portion above the retracted portion; a conductive member having at one end a connection portion formed burying the via hole and an extension portion continuous with the connection portion and extending along a direction parallel to a surface of the semiconductor substrate.
Claims19
A micro structure comprising:
- a semiconductor substrate;
- an insulating film having a via hole and formed on said semiconductor substrate;
- an interlock structure formed on a side wall of said via hole and having a retracted portion and a protruded portion above the retracted portion;
- and
- a conductive member having at one end a connection portion formed burying said via hole and an extension portion continuous with said connection portion and extending along a direction parallel to a surface of said semiconductor substrate.
2 more elements
Dependencies are inferred from the claim text.