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US 2006/0038284 A1Published application
Fluid cooled encapsulated microelectronic package
AssigneeDelphi Technologies, Inc.
InventorsScott Brandenburg, Suresh Chengalva, Thomas Degenkolb
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Abstract
An encapsulated microelectronic package includes a fluid conducting cooling tube directly coupled to one or more semiconductor chips, with the encapsulant being molded over the semiconductor chips and portions of the cooling tube in proximity to the semiconductor chips. The encapsulant immobilizes the cooling tube with respect to the semiconductor chips, and the cooling tube and encapsulant are designed to minimize differences in their coefficients of thermal expansion relative to the semiconductor chips.
Claims11
A microelectronic package, comprising:
- a first semiconductor chip;
- a fluid-carrying cooling tube disposed in proximity to a first surface of said first semiconductor chip;
- a thermally conductive bonding material disposed between said cooling tube and the first surface of said first semiconductor chip, thermally bonding said cooling tube to said first surface;
- and
- a plastic encapsulant molded over said first semiconductor chip and portions of said cooling tube in proximity to said chip.
2 more elements
Dependencies are inferred from the claim text.