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US 2006/0038273 A1Published application
Electronic packages with dice landed on wire bonds
AssigneeIntel Corporation
InventorsJicun Lu, Charles Gealer
Life of this patent
Estimating the term…
Abstract
A stacked dice electronic package without spacers between the dice and where an overlying die is landed on wire bonds of the underlying die is disclosed.
Claims28
An electronic package, comprising:
- a first die having a first surface and a second surface, the first surface being opposite of the second surface;
- a substrate coupled to the second surface of the first die;
- a plurality of wire bonds coupled to the first surface of the first die and the substrate, the wire bonds having elongated wire-type shapes with first and second opposite ends, the first ends being coupled to the first surface of the first die;
- and
- a second die having a first surface opposite of a second surface, the second surface facing the first die and landed on the plurality of wire bonds, wherein the wire bonds having vertical wire shaft portions and wire portions coupled to the vertical wire shaft portions, the vertical wire shaft portions coupled to the first ends extending vertically away from the first surface of the first die, the wire portions being at least in part oriented in a nonvertical orientation relative to the first surface of the first surface of the first die, and the second die landed at least in part on portions of the wire bonds where the wire portions and the vertical wire shaft portions couple.
2 more elements
(canceled)
(canceled)
A method, comprising:
- coupling a plurality of wire bonds to a first surface of a first die;
- and
- landing a second surface of a second die onto the plurality of wire bonds, the second surface of the second die facing the first surface of the first die.
A system, comprising:
- an electronic package, including:
- a first die having a first surface and a second surface, the first surface being opposite of the second surface;
- a substrate coupled to the second surface of the first die;
- a plurality of wire bonds coupled to the first surface of the first die and the substrate, the wire bonds having elongated wire-type shapes with first and second opposite ends, the first ends being coupled to the first surface of the first die;
- and
- a second die having a first surface opposite of a second surface, the second surface facing the first die and landed on the plurality of wire bonds, wherein the wire bonds having vertical wire shaft portions and wire portions coupled to the vertical wire shaft portions, the vertical wire shaft portions coupled to the first ends extending vertically away from the first surface of the first die, the wire portions being at least in part oriented in a nonvertical orientation relative to the first surface of the first surface of the first die, and the second die landed at least in part on portions of the wire bonds where the wire portions and the vertical wire shaft portions couple;
- a bus coupled to the electronic package;
- and
- a mass storage coupled to the bus.
6 more elements
(canceled)
Dependencies are inferred from the claim text.