US 2006/0038265 A1 · MULTI-PATH BAR BOND CONNECTOR FOR AN INTEGRATED CIRCUIT ASSEMBLY

Abstract

A solderable bar bond connector establishes a primary interconnect between a substrate and a high current terminal of an IC chip mounted on the substrate, and one or more secondary interconnects between the substrate and low current terminals of the IC chip. The bar bond connector includes a plate portion soldered to the high current terminal of the IC chip and a plurality of leg elements extending from the plate portion to multiple bond sites on the substrate. The underside of at least one leg element is provided with a secondary circuit including a conductor that is electrically isolated from the respective leg element. The conductor of the secondary circuit is soldered to both the substrate and a low current terminal of the IC chip for establishing a secondary interconnect in addition to the primary interconnect established by the plate portion and the other leg elements.

Claims11

Dependent claims

A bar bond connector for an electronic assembly including an IC chip mounted on a substrate, at least first and second terminals formed on an exposed face of said IC chip and at least first and second conductor pads formed on said substrate adjacent said IC chip, said bar bond connector comprising:

a conductive plate disposed on the exposed face of said IC chip and electrically connected to said first terminal;
a first leg element integral with said conductive plate, extending from said conductive plate, terminating in proximity to said first conductor pad, and electrically connected to said first conductor pad;
a second leg element integral with said conductive plate, extending from said conductive plate and terminating in proximity to said second conductor pad;
and
a secondary circuit affixed to said second leg element but electrically isolated therefrom, said secondary circuit including a conductor having a first end electrically connected to said second terminal, and a second end electrically connected to said second conductor pad.

2 more elements

Dependencies are inferred from the claim text.

Multi-path bar bond connector for an integrated circuit assembly

Life of this patent

Multi-path bar bond connector for an integrated circuit assembly

Life of this patent

Abstract

Claims11