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AssigneesRenesas Technology Corp., Kabushiki Kaisha Toshiba, Shinko Electric Industries Co., Ltd.
InventorsYoshihiko Nemoto, Masahiro Sunohara, Kenji Takahashi
Estimating the term…
A conveyance system for a semiconductor wafer can be used without any change before and after a support plate is adhered to the wafer. Also, the finish accuracy of the wafer and the positioning accuracy between the wafer and the support plate can be relaxed, thus improving the manufacturing efficiency. The wafer is formed on its peripheral portion with a stepped portion, which is deeper than a finished thickness obtained by partial removal of the rear surface thereof and which can be eliminated by the partial removal of the wafer rear surface. The separation portion has a length which extends radially outward from a flat surface, and which is greater than a total sum of a maximum-minimum difference between the finish allowances of the diameters of the wafer and the support plate, and a maximum value of a positioning error between the wafer and the support plate generated upon adhesion thereof.
A semiconductor wafer having a front surface which is a flat surface with a semiconductor circuit formed thereon and to which a support plate is adhered, and a rear surface of which is partially removed to reduce its thickness,
5-8. (canceled)
Dependencies are inferred from the claim text.