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US 2006/0038202 A1Published application
Heatsink apparatus and thermally-conductive intermediate material for dissipating heat in semiconductor packages
OwnerBernhard Langeinventor
Life of this patent
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Abstract
A semiconductor package comprising a die adjacent a lead frame die pad, said lead frame die pad adapted to dissipate heat from the die. The package further comprises a thermally-conductive material abutting the die and a heatsink abutting the thermally-conductive material, said heatsink facing a direction opposite from the lead frame die pad.
Claims27
A semiconductor package, comprising:
- a die adjacent a lead frame die pad, said lead frame die pad adapted to dissipate heat from the die;
- a thermally-conductive material abutting the die;
- and
- a heatsink abutting the thermally-conductive material on an opposite side of said die from said lead frame die pad.
1 more element
12-17. (canceled)
An apparatus, comprising:
- a plurality of heatsinks, at least one of said heatsinks adapted to couple to a thermally-conductive material abutting a die on a semiconductor wafer;
- and
- an aperture between at least some of the heatsinks, said aperture adapted to facilitate the deposition of a mold compound.
A semiconductor package, comprising:
- an integrated circuit element having a top surface adapted for connecting the chip electrically to leads external to the chip, and a bottom surface;
- a heatsink having a top surface with a first area, and a substantially flat bottom surface with a smaller second area to which the top surface of the integrated circuit element is attached;
- a die pad having a bottom surface, and a top surface to which the bottom surface of the integrated circuit element is attached;
- and
- a mold compound element encapsulating the semiconductor package, including covering the bottom surface of the heatsink that is uncovered by the integrated circuit element, and the top surface of the die pad that is uncovered by the integrated circuit element.
2 more elements
Dependencies are inferred from the claim text.