Circuit board with SMD-components and at least one wired component, and a method for populating, securing and electrical contacting of the components

The method for populating, securing and electrical contacting of electric and electronic components on a circuit board, comprising the steps of:

• producing in the circuit board a plurality of connection bores for receiving connection pins, and/or wires, of at least one wired, electric or electronic component each from at least two bores, which intersect such that a constriction is formed in each connection bore in an overlap region of the bores;
• applying solder paste on solder pads and conductive adhesive on and/or into the connection bore for the wired, electric or electronic component on one side of the circuit board;
• populating SMD-components onto the soldering pads and inserting the connection pins, or wires, of the wired component into the connection bore;
• and
• soldering the solder paste and drying the conductive adhesive in a reflow soldering oven.

The method for the two-sided populating, securing and electrical contacting of electric and electronic components on a circuit board, comprising the steps of:

• producing in the circuit board a plurality of connection bores for receiving connection pins, and/or wires, of at least one wired, electric or electronic component each from at least two bores, which intersect such that a constriction is formed in each connection bore in an overlap region of the bores;
• applying conductive adhesive on and/or into the connection bore for the wired electric or electronic component on a second side of the circuit board;
• inserting the connection pins, or wires, of the wired component into the connection bores;
• applying solder paste on solder pads on a first side of the circuit board;
• populating SMD-components on the solder pads of the first side of the circuit board;
• and
• soldering the solder paste and drying the conductive adhesive in a reflow soldering oven, wherein the circuit board shields the wired component during passage through the reflow soldering oven from the heat required for the soldering.

The method for the two-sided populating, securing and electrical contacting of electric or electronic components on a circuit board, comprising the steps of:

• producing in the circuit board a plurality of connection bores for receiving connection pins, and/or wires, of at least one wired, electric or electronic component each from at least two bores, which intersect such that a constriction is formed in each connection bore in an overlap region of the bores;
• applying solder paste on solder pads on a first side of the circuit board;
• populating SMD-components on the solder pads on the first side of the circuit board;
• soldering the first side of the circuit board in a reflow soldering oven;
• applying solder paste on solder pads and applying conductive adhesive on and/or into the connection bore for the wired, electric or electronic component on a second side of the circuit board;
• inserting the connection pins, or wires, of the wired component into the connection bore;
• populating SMD-components on the solder pads of the second side of the circuit board;
• and
• soldering the solder paste and drying the conductive adhesive in a reflow soldering oven.

A method for the two-sided populating, securing and electrical contacting of electric or electronic components on a circuit board, comprising the steps of:

• producing in the circuit board a plurality of connection bores for receiving connection pins, and/or wires, of at least one wired, electric or electronic component each from at least two bores, which intersect such that a constriction is formed in each connection bore in an overlap region of the bores;
• applying solder paste on solder pads on a first side of the circuit board;
• populating SMD-components on the solder pads;
• soldering the solder paste and the SMD-components on the first side of the circuit board in a reflow soldering oven;
• inserting the connection pins, or wires, of the wired component into the connection bore;
• applying solder paste on solder pads and applying conductive adhesive on and/or into the connection bore for the wired, electric or electronic component on a second side of the circuit board;
• populating SMD-components on the solder pads of the second side of the circuit board;
• and
• soldering the solder paste and the SMD-components of the second side of the circuit board and drying the conductive adhesive in a reflow soldering oven, wherein the circuit board shields the wired component during passage through the reflow soldering oven from the heat required for the soldering.

A method for the two-sided populating, securing and electrical contacting of SMD-components and a plurality of wired components, of which at least one is a thermally critical, wired component, on a circuit board, comprising the steps of:

• producing in the circuit board a plurality of connection bores for receiving connection pins, and/or wires, of at least one wired, electric or electronic component each from at least two bores, which intersect such that a constriction is formed in each connection bore in an overlap region of the bores;
• applying solder paste on solder pads on a first side of the circuit board;
• populating SMD-components on the solder pads;
• soldering the first side of the circuit board in a reflow soldering oven;
• applying adhesive onto a second side of the solder board for securing SMD-components;
• populating the second side of the circuit board with SMD-components;
• populating the one or more wired and thermally uncritical components on the first side of the circuit board;
• soldering in a wave soldering facility;
• applying conductive adhesive onto and/or into the connection bore for the wired, electric or electronic component on the second side of the circuit board;
• inserting the connection pins, or wires, of the thermally critical, wired component into the connection bore;
• and
• curing the conductive adhesive.