Method and apparatus for removing material from a substrate surface
AssigneeNanofilm Technologies International Pte Ltd
InventorsXu Shi, Li Cheah
Life of this patent
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Abstract
Methods and apparatus for removing material from a substrate, such as an IC component, are disclosed. The methods include creating a plasma in an evacuatable chamber, by providing a power source to an electrode in the chamber, and contacting the substrate surface with at least one of ions, atoms and free radicals of the plasma. The power source, preferably DC, is supplied to the electrode as a variable, and preferably a pulsed voltage to prevent arcing.
Claims31
A method of removing material from a substrate surface comprising the steps of:
- providing a plasma using a power source;
- and
- contacting the substrate surface with one or more of ions, atoms or free radicals of the plasma,
- wherein the power source is supplied as a variable voltage.
A method of removing material from a substrate surface comprising the steps of:
- placing the substrate in an evacuatable chamber having an electrode therein;
- providing a variable voltage to the electrode to provide a plasma in the chamber between the electrode and the substrate;
- and
- contacting the substrate surface with one or more of ions, atoms or free radicals of the plasma to remove at least a portion of the material on the surface.
Apparatus for removing material from a substrate surface comprising:
- a vacuum chamber;
- an electrode in the vacuum chamber;
- and
- a power source for providing a variable voltage to the electrode, such that a plasma is formable within the chamber and one or more of ions, atoms or free radicals of the plasma contact the substrate surface,
- wherein the power source is supplied as a variable voltage.
Dependencies are inferred from the claim text.