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US 2006/0037182 A1Published application
Method and apparatus for the improvement of material/voltage contrast
AssigneeCredence Systems Corporation
InventorsErwan Roy, William Thompson
Life of this patent
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Abstract
A method and system for registering a CAD layout to a Focused Ion Beam image for through-the substrate probing, without using an optical image and without requiring biasing, includes an improved method of trench endpointing during the FIB milling operation with a low beam energy. The method further includes removal of Ga at the trench floor using XeF2, as well as the deposition of an insulating layer onto the trench floor.
Claims31
A wafer portion probing system comprising:
- a charged particle beam column for generating a charged particle beam that, when directed at a location on a surface of an integrated circuit wafer portion, generates secondary electrons;
- a detector for detecting said secondary electrons;
- an image generator for generating, based on an output of said detector, an image of structures within said surface of said wafer portion;
- a computing device configured to navigate, based on said image, to a specified location on said wafer portion;
- and
- a source of at least one of:
- light and heat, for exposing said wafer portion thereto in situ.
4 more elements
Dependencies are inferred from the claim text.