Contacting structure for a semiconductor material and a method for providing such structures
AssigneeImec
InventorsVladimir Arkhipov, Paul Heremans
Life of this patent
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AssigneeImec
InventorsVladimir Arkhipov, Paul Heremans
Estimating the term…
Contact structures and methods for forming such contact structures are disclosed. An example contact structure includes a layer of semiconductor material having an interface and an electrical contact at the interface of the layer of semiconductor material, where the electrical contact includes a granular metal. An example method for forming a contact structure includes providing a substrate and producing a granular metal on at least part of the substrate, where the granular metal includes a cluster of metal islands extending essentially in a two-dimensional plane. The method further includes depositing a layer of a semiconductor material on top of the substrate and the cluster of metal islands.
A contact structure comprising:
A semiconductor device in which complementary charge carriers are required for proper operation of the semiconductor device, the semiconductor device comprising:
A method for producing an electrical contact at an interface of a semiconductor material, the method comprising:
A method for producing an electrical contact at an interface of a semiconductor material, the method comprising:
Dependencies are inferred from the claim text.