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US 2006/0033206 A1Published application
Semiconductor cooling system and process for manufacturing the same
AssigneeDtnr Ltd.
InventorsEliezer Adar, Vladimir Gotlib
Life of this patent
Estimating the term…
Abstract
A cooling device for an element such as a microprocessor in a computer, and a process for manufacturing the cooling device. The cooling device provides an effective structure of cooling a microprocessor by providing a metallic filler layer and a metal plate layer spreading out heat generated from the microprocessor, and thereby effectively thermally conducting heat away from the microprocessor. Further, a semiconductor thermoelectric module can be utilized to further cool the microprocessor.
Claims45
A cooling device, comprising
- an element to be cooled and including a surface outputting heat;
- a first metallic filler layer configured to cover and to be in thermal conductive contact with an entire portion of said surface of said element outputting heat;
- a first metal plate covering and in thermal conductive contact with a surface of said first metallic filler layer, the first metal plate having a greater area than an area of said first metallic filler layer.
A cooling device comprising:
- an element to be cooled including a surface outputting heat;
- first means for conducting heat away from said surface of said element outputting heat;
- and
- means for cooling for element to be cooled, in thermal conduction with said first means for conducting.
1 more element
A process for manufacturing a cooling device, comprising
- providing an element to be cooled and including a surface outputting heat;
- providing a first metallic filler layer to cover and to be in thermal conductive contact with an entire portion of said surface of said element outputting heat;
- providing a first metal plate to cover and to be in thermal conductive contact with a surface of said first metallic filler layer, the first metal plate having a greater area than an area of said first metallic filler layer.
Dependencies are inferred from the claim text.