Integrated circuit package and method for manufacturing same

A method for manufacturing an integrated circuit package, the method comprising the steps of:

• (a) providing a substrate comprising two opposite surfaces;
• (b) forming a die on one surface of the opposite surfaces of the substrate;
• (c) providing an integrated heat spreader comprising an inner face and an outer face;
• (d) forming an array of carbon nanotubes on the inner face of the integrated heat spreader;
• (e) fixing the integrated heat spreader on the substrate such that the integrated heat spreader is set above the die;
• (f) packaging the substrate, the die and the integrated heat spreader;
• and
• (g) welding solder balls on the other of the opposite surfaces of the substrate, wherein top and bottom ends of the carbon nanotubes perpendicularly contact the integrated heat spreader and the die respectively.

A method for manufacturing an integrated circuit package, the method comprising the steps of:

• providing a substrate having an electrifiable die thereon;
• providing a heat spreader capable of heat dissipation;
• forming an array of carbon nanotubes on a face of said heat spreader;
• placing said heat spreader next to said substrate to have said face of said heat spreader facing said die and establish a heat transmissible path between said heat spreader and said die via said array of carbon nanotubes;
• and
• packaging said heat spreader and said substrate together to form said integrated circuit package.