Electronic component packaging
OwnerChien-Hua Chen, Troy Schwinabart +1inventors
InventorsChien-Hua Chen, Troy Schwinabart, David Craig
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Abstract
One embodiment of an electronic component packaging system includes a base adapted for supporting an electronic component and including a mechanically planarized sealing surface, and a lid including a mechanically planarized sealing surface sealed to the planarized sealing surface of the base so as to define a hermetic seal therebetween.
Claims52
An electronic component packaging system, comprising:
- a base adapted for supporting an electronic component and including a mechanically planarized sealing surface;
- and
- a lid including a mechanically planarized sealing surface sealed to said planarized sealing surface of said base so as to define a hermetic seal therebetween.
A process of plasma bonding an electronic component package, comprising:
- activating an electronic component container sealing surface and a lid sealing surface with a plasma;
- and
- contacting the electronic component container sealing surface and the lid sealing surface to form a hermetic seal.
An electronic component package, comprising:
- a lid;
- a container adapted for supporting an electronic component;
- and
- a non-solder bonding layer that bonds said lid and said container together.
A process of sealing an electronic component package, comprising:
- contacting a sealing surface of a first package structure to a sealing surface of a second package structure at a temperature of less than 200 degrees Celsius so as to form a hermetic seal between said first and second package structures.
A method of sealing an electronic package, comprising:
- applying a sealing material to at least one of a cap and a base;
- mechanically planarizing a mating surface of said cap and a mating surface of said base;
- and
- contacting said mating surface of said cap and said mating surface of said base such that said sealing material seals said cap and said base together.
An electronic device package, comprising:
- means for mounting an electronic device;
- and
- means for capping said means for mounting, said means for capping hermetically sealed to said means for mounting by a plasma activated seal.
Dependencies are inferred from the claim text.