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US 2006/0033122 A1Published application
Half-bridge package
AssigneeInternational Rectifier Corporation
InventorsMark Pavier, Ajit Dubhashi, Norman Connah, Jorge Cerezo
Life of this patent
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Abstract
A semiconductor package which includes two power semiconductor die arranged in a half-bridge configuration.
Claims16
A semiconductor device package comprising:
- a first semiconductor die having a first power electrode and a control electrode on a surface thereof and a second power electrode on an opposing surface thereof;
- a second semiconductor die having a first power electrode and a control electrode on a surface thereof and a second power electrode on an opposing surface thereof;
- a split conductive pad including two isolated die pads, each being electrically connected to a respective one of said second power electrodes;
- a plurality of leads including at least one output lead electrically connected to said first electrode of said first semiconductor die and said second electrode of said second semiconductor die;
- and
- a housing enclosing said die and at least portions of said isolated pads, wherein each said die pad includes a portion that extends to the exterior of said housing, said portions being isolated and spaced from one another.
3 more elements
Dependencies are inferred from the claim text.