System, apparatus and method of selective laser repair for metal bumps of semiconductor device stack
OwnerKang-Wook Lee, Se-Young Jeonginventors
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Abstract
Exemplary embodiments of the selective laser repair apparatus and method may allow the repair of metal bumps in a semiconductor device stack by applying a laser beam to a damaged and/or defective bump. Metal bumps may be repaired and individual chips and/or packages forming a device stack need not be separated. The operation of a control unit and a driving unit may position a laser unit such that a laser beam may be irradiated at the damaged and/or defective metal bump. An X-ray inspection unit may obtain information about the damaged and/or defective metal bump.
Claims13
An apparatus for selectively repairing metal bumps of a semiconductor device stack having a plurality of chips or packages connected by the metal bumps, the apparatus comprising:
- a stage unit, on which the semiconductor device stack is loaded;
- a laser unit adapted to generate a laser beam and selectively irradiate the laser beam at a metal bump of the semiconductor device stack;
- a driving unit connected to the laser unit and adapted to supply a force to the laser unit;
- and
- a control unit connected to the laser unit and the driving unit and adapted to control the laser unit and the driving unit,
- wherein the laser unit is located at a position suitable for irradiating the laser beam at a metal bump, and wherein the laser beam is irradiated at the metal bump while the laser beam is focused on the metal bump.
A method for selectively repairing metal bumps of a semiconductor device stack having a plurality of chips or packages connected by the metal bumps, the method comprising:
- inspecting the semiconductor device stack;
- identifying a damaged metal bump;
- and
- repairing the damaged metal bump by selectively irradiating a laser beam at the damaged metal bump.
Dependencies are inferred from the claim text.