Back to results
US 2006/0032835 A1Published application
Method and apparatus for simulating standard test wafers
AssigneeLam Research Corporation
InventorsGregory Goldspring, Robert O'Donnell
Life of this patent
Estimating the term…
Abstract
A method and apparatus are provided for simulating a standard wafer in semiconductor manufacturing equipment. The apparatus includes a support layer suitable for being handled by the semiconductor manufacturing equipment. Applied to the support layer is a mixture including a process agent and a material. During use, the present invention simulates a standard production wafer including material similar to that in the mixture of the present invention.
Claims20
A process for manufacturing an apparatus suitable for use in simulating a standard wafer in semiconductor manufacturing equipment, comprising:
- combining a process agent and a material;
- and
- applying the combination of the process agent and the material to a support layer to simulate a wafer including the material and having the process agent thereon.
Dependencies are inferred from the claim text.