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US 2006/0032834 A1Published application
Method of manufacturing semiconductor wafer and method of manufacturing semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorsTomohiro Iguchi, Kentaro Suga, Taizo Tomioka
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Abstract
According to a method of manufacturing a semiconductor wafer and a semiconductor device, a rear surface of the semiconductor wafer is ground, and is dry—or wet—etched so that rear surfaces of semiconductor chips on the segmented semiconductor wafer have substantially equal surface roughness. The semiconductor chips are bonded onto a lead frame via bumps using thermo-compression and ultrasonic vibrations.
Claims20
A method of manufacturing a semiconductor wafer, the method comprising:
- forming a plurality of circuits on a diced main surface of a semiconductor wafer, the main surface of the semiconductor wafer serving as semiconductor chip forming regions;
- grinding a rear surface of the semiconductor wafer;
- and
- applying surface treatment to the rear surface of the semiconductor wafer and uniforming roughness of the rear surface of the semiconductor wafer, the rear surface being opposite to the main surface.
1 more element
A method of manufacturing a semiconductor device, the method comprising:
- forming a plurality of circuits on a diced main surface of a semiconductor wafer, the main surface of the semiconductor wafer serving as a semiconductor chip forming region;
- grinding a rear surface of the semiconductor wafer;
- applying surface treatment to the rear surface of the semiconductor wafer and uniforming roughness of the rear surface of the semiconductor wafer, the rear surface being opposite to the main surface;
- segmenting the semiconductor wafer for each semiconductor chip forming region, and producing a plurality of semiconductor chips;
- and
- bringing electrodes on a main surface of the semiconductor chip into contact with a target object via bumps, thermo-compressing the electrodes and a target object by applying ultrasonic vibrations from the rear surface of the semiconductor chip, thereby bonding the semiconductor chips to the target object via the bumps.
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Dependencies are inferred from the claim text.