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US 2006/0032784 A1Published application
Foam laminate system for semiconductor wafers
OwnerValoris Forsythinventor
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Abstract
A cushion-like device is provided for the transportation of semiconductor wafers. The device includes an interior formed from polyethylene closed cell foam that utilizes a foaming agent that imparts minimal alkanes and cations into the polyethylene foam material. An electrostatic discharge dissipative polyethylene film surrounds the foam interior and is joined thereto by hot melt EVA material. An array of apertures of approximately 0.010 inch diameter and less than 0.25 inch spacing is formed in the film to allow the foam to compress upon impact.
Claims9
A device for cushioning semiconductor wafer, comprising:
- a foam interior;
- and
- a film surrounding said foam interior, said film having antistatic characteristics and apertures to allow for compression of said foam interior upon impact.
Dependencies are inferred from the claim text.