Connection structures for microelectronic devices and methods for forming such structures

A connection structure for a microelectronic device, comprising:

• a first layer, comprising a substrate having first and second opposing surfaces and a plurality of holes extending through the first and second surfaces, and a plurality of first posts, each post being electrically conductive and extending from a base at the first surface of the first substrate toward a tip;
• a plurality of second posts, each post being electrically conductive and extending from a base toward a tip in a corresponding hole of the substrate;
• and
• a dielectric material between the substrate and at least one of the second posts.

A connection structure for a microelectronic device, comprising:

• a first substrate having first and second opposing surfaces and a plurality of holes extending through the first and second surfaces;
• and
• a second substrate having a surface facing the first surface of the first substrate;
• a plurality of posts, each post being electrically conductive and extending from a base at the surface of the second substrate toward a tip located within a corresponding hole of the first substrate;
• and
• a dielectric material between the substrates.

A method for forming a connection structure for a microelectronic device, comprising:

• (a) providing first and second layers, wherein each layer is comprised of
• a substrate having a first surface, a second surface opposing the first surface, and a plurality of holes extending through the first and second surfaces, and
• a plurality of electrically conductive posts, each post extending from a base at the first surface toward a tip;
• and
• (b) positioning the layers relative to each other such that
• the first surfaces face each other,
• each tip of the posts of the first layer is located in a corresponding hole of the second substrate
• each tip of the posts of the second layer is located in a corresponding hole of the first substrate.

A method for forming a connection structure for a microelectronic device, comprising:

• (a) providing
• a first layer, comprising a substrate having a first surface, a second surface opposing the first surfaces, and a plurality of holes extending through the first and second surfaces, and a plurality of first electrically conductive posts, each first post extending from a base at the first surface toward a tip, and
• a second layer comprising a plurality of second posts, each second post being electrically conductive and extending from a base toward a tip;
• and
• (b) positioning second layer such that the second posts extend through a dielectric material and each tip of the second posts is located in a corresponding hole of the first substrate.

A method for forming a connection structure for a microelectronic device, comprising:

• (a) providing
• a first layer, comprising a first substrate having first and second opposing surfaces and a plurality of holes extending through the first and second surfaces, and
• a second layer, comprising a second substrate and a plurality of posts, each post being electrically conductive and extending from a base at a surface of the second substrate toward a tip;
• (b) positioning the layers such that the surface of the second substrate faces the first surface of the substrate, each tip of the posts is located within a corresponding hole of the first substrate, and a dielectric material is interposed between the substrates.