Printed circuit boards and method of producing the same
AssigneeIbiden Co., Ltd.
InventorsYoshinori Wakihara, Kazuhito Yamada
Life of this patent
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Abstract
A printed circuit board is by formed by laminating an interlaminar insulating layer on a conductor circuit of a substrate, in which the conductor circuit is comprised of an electroless plated film and an electrolytic plated film and a roughened layer is formed on at least a part of the surface of the conductor circuit.
Claims21
A printed circuit board provided with a conductor layer used as an alignment mark, in which a roughened layer is formed on at least a part of the surface of the conductor layer.
A printed circuit board provided with a conductor layer used as an alignment mark, in which the conductor layer is comprised of an electroless plated film and an electrolytic plated film.
21-25. (canceled)
Dependencies are inferred from the claim text.