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US 2006/0032665 A1Published application
Single layer flex circuit
AssigneeFinisar Corporation
InventorDonald Ice
Life of this patent
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Abstract
Novel single-layer flexible circuits are provided including a top flexible substrate, a bottom flexible substrate, and a conductive layer disposed therebetween. Signal traces and ground traces can be located in the conductive layer.
Claims19
A flexible circuit comprising:
- a first flexible substrate having a first end and a second end;
- a second flexible substrate having a first end and a second end;
- and
- a single conductive layer disposed between the first flexible substrate and the second flexible substrate, at least a portion of the conductive layer having a neutral bending axis.
1 more element
A flexible circuit comprising:
- a top flexible substrate;
- a bottom flexible substrate;
- at least one signal trace disposed between the top flexible substrate and the bottom flexible substrate;
- and
- at least one ground trace disposed between the top flexible substrate and the bottom flexible substrate, wherein at least a portion of the at least one signal trace and at least a portion of the at least one ground trace are disposed in the same plane.
2 more elements
A flexible circuit comprising:
- a top flexible substrate;
- a bottom flexible substrate having a top surface and a bottom surface;
- a single conductive layer disposed between the top flexible substrate and the bottom flexible substrate;
- at least one via located in the bottom flexible substrate;
- and
- at least one bonding pad disposed on the bottom surface of the bottom flexible substrate, the at least one bonding pad being electrically connected to the conductive layer through the at least one via.
3 more elements
Dependencies are inferred from the claim text.