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US 2006/0032616 A1Published application
Compound heat-dissipating device
AssigneeGiga-Byte Technology Co., Ltd.
InventorHsiang-Hsi Yang
Life of this patent
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Abstract
A compound heat-dissipating device is used to help a chip or a CPU to dissipate excessive heat. The compound heat-dissipating device has two heat sinks, two fans respectively arranged on the two heat sinks, and a heat pipe connected between the two heat sinks for increasing efficiency of heat dissipation.
Claims7
A compound heat-dissipating device, comprising:
- a first heat sink;
- a first fan disposed on the first heat sink;
- at least one heat pipe comprising a first side and second side, the first side connecting to the first heat sink;
- a second heat sink connecting to the second side of the at least one heat pipe;
- and
- a second fan disposed on the second heat sink.
3 more elements
Dependencies are inferred from the claim text.