Apparatus and method for fabricating bonded substrate
AssigneeFujitsu Limited
InventorsTakanori Muramoto, Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima
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Abstract
A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.
Claims6
An apparatus for fabricating a bonded substrate by bonding two substrates, the apparatus comprising:
- a process chamber;
- and
- first and second holding plates, arranged in the process chamber to face each other, to hold the two substrates and bond the substrate to each other, wherein at least one of the first or second holding plates is configured to electrostatically hold at least one of the substrates after elevating pressure in the process chamber to a predetermined elevated pressure higher than an atmospheric pressure.
A method of bonding two substrates held by first and second holding plates arranged to face each other in a process chamber, the method comprising:
- vacuum holding at least one of the two substrates by at least one of the first or second holding plates in the process chamber;
- feeding a gas in the process chamber to elevate pressure in the process chamber to a predetermined elevated pressure higher than the atmospheric pressure;
- and
- electrostatically holding said at least one of the two substrates by said at least one of the first or second holding plates after the pressure in the process chamber is elevated to the predetermined pressure.
Dependencies are inferred from the claim text.