Compliant multi-composition interconnects

An apparatus comprising:

• a substrate including a metal pad;
• a passivation layer disposed on said substrate, including an opening exposing the metal pad;
• and
• a compliant interconnect disposed on a portion of said substrate and said metal pad, the compliant interconnect having at least a first metal layer of a first metal composition with a first thickness and having a first amount of internal stress, and a second metal layer of a second metal composition, stacked on top of the first layer, with a second thickness and having a second amount of internal stress.

A system comprising:

• a component having;
• a substrate including a metal pad;
• a passivation layer disposed on the substrate, including an opening exposing the metal pad;
• a compliant interconnect disposed on a portion of the or passivation layer and the metal pad, the compliant interconnect having at least a first metal layer of a first metal composition with a first thickness and having a first amount of internal stress, and a second metal layer of a second metal composition, stacked on top of the first layer, with a second thickness and having a second amount of internal stress;
• a bus coupled to the component;
• and
• a networking interface coupled to the bus.

A method comprising:

• forming a substrate with a metal pad;
• forming a passivation layer with an opening on top of the substrate, the opening exposing said metal pad;
• and
• forming a compliant interconnect on a portion of the passivation layer and the metal pad, with the compliant interconnect having at least a first metal layer of a first metal composition with a first thickness and having a first amount of internal stress, and a second metal layer of a second metal composition, stacked on top of the first layer, with a second thickness and having a second amount of internal stress.