Process for producing a multilayer arrangement having a metal layer
AssigneeInfineon Technologies AG
InventorsEike Ruttkowski, Gurkan Ilicali, Richard Luyken, Franz Hofmann, Manuela Bueno
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Abstract
Process for producing a multilayer arrangement having a metal layer, in which a metal layer is applied to a surface of a first wafer and at least one interlayer is applied to the metal layer. Furthermore, a second wafer is applied to the interlayer and then the first wafer is removed, so that the metal layer is uncovered.
Claims21
1-14. (canceled)
A process for producing a multilayer arrangement having a metal layer in a molecular electronic arrangement, comprising the steps of:
- applying the metal layer to a surface of a first wafer;
- applying at least one interlayer to the metal layer;
- applying a second wafer to the interlayer;
- and
- removing the first wafer, so that the metal layer is uncovered.
The process as claimed in claim 33, further comprising the step of removing the photoresist layer.
Dependencies are inferred from the claim text.