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US 2005/0239268 A1Published application
Integrated circuit with removable scribe street trim and test pads
AssigneeTexas Instruments Incorporated
InventorsRex Pirkle, Sean Malolepszy, Eric Bernard
Life of this patent
Estimating the term…
Abstract
A method comprises forming a pad in a scribe street adjacent to an integrated circuit (“IC”), electrically connecting the pad to the IC, and sawing the scribe street. A wafer is also disclosed as comprising an IC, a scribe street and a pad formed in the scribe street.
Claims17
A method, comprising:
- forming a pad in a scribe street adjacent to an integrated circuit (“IC”);
- electrically connecting the pad to the IC;
- and
- sawing the scribe street.
1 more element
A wafer, comprising:
- an IC;
- a scribe street adjacent to said IC;
- and
- a pad formed in the scribe street, said pad electrically connected to the IC.
1 more element
Dependencies are inferred from the claim text.