Patterning process and resist overcoat material
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsJun Hatakeyama, Yuji Harada
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Abstract
In an immersion lithography process, a pattern is formed by forming a photoresist layer on a wafer, forming a protective coating on the photoresist layer from a resist overcoat material, exposing the layer structure to light in water, and developing. A water-insoluble, alkali-soluble material is used as the resist overcoat material.
Claims10
An immersion lithography process for forming a pattern, comprising the steps of forming a photoresist layer on a wafer, forming a protective coating on the photoresist layer from a resist overcoat material, exposing the layer structure to light in water, and developing,
- said resist overcoat material being a water-insoluble, alkali-soluble material.
For use in an immersion lithography process for forming a pattern, comprising the steps of forming a photoresist layer on a wafer, forming a protective coating on the photoresist layer from a resist overcoat material, exposing the layer structure to light in water, and developing,
- the resist overcoat material comprising a polymer having copolymerized recurring units containing fluorine and recurring units having sulfo or carboxyl groups.
Dependencies are inferred from the claim text.