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US 2005/0231920 A1Published application
RIM slot filler module and method of manufacturing the same
AssigneeTeradyne, Inc.
InventorsMartin Culpepper, Rohit Girdhar, Sarosh Patel
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Abstract
A slot filler module is presented. The slot filler module includes a RIM molded encapsulant, an insert disposed in a predetermined location within the encapsulant and a connector disposed proximate a first end of the RIM molded encapsulant.
Claims21
A slot filler module for replacing an optional electronics module in a system, comprising:
- a reaction injection molded (RIM) encapsulant;
- and
- at least one insert disposed in a predetermined location within said encapsulant, wherein said encapsulant and said at least one insert have approximately the same mass as the electronics module.
A method of providing a slot filler module comprising:
- selecting at least one insert;
- positioning said at least one insert within a mold;
- reaction injection molding an encapsulant within said mold, said encapsulant surrounding said at least one insert;
- and
- releasing said encapsulant from said mold.
2 more elements
Dependencies are inferred from the claim text.