Methods of inserting or removing a species from a substrate

A method of delivering a new species to a semiconductor substrate, comprising:

• a) introducing a filling fluid comprising the new species into a vessel while setting pressure in the vessel at an elevated level, the vessel containing the semiconductor substrate;
• b) maintaining the pressure in the vessel at the elevated level for a predetermined period of time;
• c) lowering the pressure in the vessel to a lower level by removing fluid from the vessel;
• and
• d) repeating steps a), b) and c) at least once, thereby delivering the new species to the semiconductor substrate.

A method for removing a species from a substrate, comprising:

• a) introducing a purging fluid into a vessel containing the substrate while setting pressure in the vessel at an elevated level, the purging fluid being substantially free of the species;
• b) maintaining the pressure in the vessel at the elevated level for a predetermined period of time;
• c) lowering the pressure in the vessel to a lower level by removing fluid from the vessel, the fluid including the species, the species being removed from voids in the substrate;
• and
• d) repeating steps a), b), and c) at least once, thereby removing the species from the substrate.

A method for removing a species from a substrate, comprising:

• a) introducing a purging fluid into a vessel containing the substrate while setting pressure in the vessel at an elevated level, the substrate having a surface area of at least about 1 m2/g;
• the purging fluid being substantially free of the species;
• b) maintaining the pressure in the vessel at the elevated level for a predetermined period of time;
• c) lowering the pressure in the vessel to a lower level by removing fluid from the vessel, the fluid including the species to be removed;
• and
• d) repeating steps a), b), and c) at least once, thereby removing the species from the substrate.

A method for inserting a new species into a substrate, comprising:

• a) introducing a filling fluid comprising the new species into a vessel while setting pressure in the vessel at an elevated level, the vessel containing the substrate with voids;
• b) maintaining the pressure in the vessel at the elevated level for a predetermined period of time, the new species being inserted into the voids;
• c) lowering the pressure in the vessel to a lower level by removing fluid from the vessel;
• and
• d) repeating steps a), b) and c) at least once, thereby inserting the new species into the substrate.

A method for regenerating a gas purification substrate, comprising:

• a) introducing a purging fluid into a vessel containing the gas purification substrate while setting pressure in the vessel at an elevated level;
• b) maintaining the pressure in the vessel at the elevated level for a predetermined period of time;
• c) lowering the pressure in the vessel to a lower level by removing fluid from the vessel;
• and
• d) repeating steps a), b) and c) at least once, thereby regenerating the gas purification substrate.