US 2005/0229393 A1 · Methods of forming a contact pin assembly

Abstract

A compliant contact pin assembly method for making is provided. A compliant contact pin assembly includes a contact pin formed from a portion of a substrate with the contact pin compliantly held suspended within the substrate by a compliant coupling structure. The suspension within the substrate results in a compliant deflection orthogonal to the plane of the substrate. The contact pin assembly is formed by generally thinning the substrate around the contact pin location and then specifically thinning the substrate immediately around the contact pin location for forming a void. The contact pin is compliantly coupled, in one embodiment by compliant coupling material, and in another embodiment by compliantly flexible portions of the substrate.

Claims22

Dependent claims

A method of forming a contact pin assembly, comprising:

thinning a substrate around a first location on a first side defined for forming a contact end of a first contact pin, the contact end extending above the substrate by a height approximating an intended distance of travel of the first contact pin within the contact pin assembly transverse to a plane of the substrate;
locally thinning the substrate to form a first void immediately around a location of the first contact pin on the first side of the substrate to a selected depth;
at least partially filling the first void with a compliant coupling material;
and
thinning a second side of the substrate to release the first contact pin in the first void from the substrate.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application

11/152,496Filed 14 Jun 2005

Priority

2 Mar 2004

Published

20 Oct 2005

Term ends

Not estimatedThe source records don’t support an estimate.

Classification29 codes

G01R 1/0735
With individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or…:…
H01R 12/714
Co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit: with…
H05K 3/326
By abutting or pinching; Mechanical auxiliary parts therefor: the printed circuit having integral resilient or deformable parts, e.g. tabs or…
H05K 7/1069
Co-operating by abutting: with spring contact pieces

Methods of forming a contact pin assembly

Life of this patent

Methods of forming a contact pin assembly

Life of this patent

Abstract

Claims22