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US 2005/0218397 A1Published application
NANO-electronics for programmable array IC
AssigneeAvailableIP.com
InventorBao Tran
Life of this patent
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Abstract
Systems and methods are disclosed to process a programmable semiconductor substrate by fabricating a first layer on the substrate using semiconductor fabrication techniques; fabricating a second layer above the first layer having one or more NANO-bonding areas; self-assemblying one or more NANO-elements; and bonding the NANO-elements to the NANO-bonding areas.
Claims20
A reconfigurable electronic device, comprising:
- a substrate;
- a first layer having semiconductor elements fabricated using semiconductor fabrication techniques;
- a second layer formed above the first layer, the second layer having one or more NANO-bonding areas;
- and
- one or more reconfigurable NANO-elements self-assembled to the second layer molecular bonding areas.
2 more elements
A reconfigurable electronic device, comprising:
- a substrate;
- a first layer having semiconductor elements fabricated using semiconductor fabrication techniques;
- a second layer formed above the first layer, the second layer having one or more NANO-bonding areas;
- and
- one or more NANO-elements self-assembled to the second layer molecular bonding areas,
- wherein at least one of the semiconductor elements in the first layer or the NANO-elements are reconfigurable.
3 more elements
A method to process a programmable semiconductor substrate, comprising:
- fabricating a first layer on the substrate using semiconductor fabrication techniques;
- fabricating a second layer above the first layer having one or more NANO-bonding areas;
- and
- self-assemblying one or more NANO-elements;
- bonding the NANO-elements to the NANO-bonding areas;
- and
- programming the NANO-elements.
4 more elements
Dependencies are inferred from the claim text.