Deposition of buffer layers on textured metal surfaces
AssigneeAmerican Superconductor Corporation
InventorsMartin Rupich, Urs-Detlev Schoop, Darren Verebelyi, Thomas Kodenkandath, Xiaoping Li
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AssigneeAmerican Superconductor Corporation
InventorsMartin Rupich, Urs-Detlev Schoop, Darren Verebelyi, Thomas Kodenkandath, Xiaoping Li
Estimating the term…
A method of making a multilayer article includes depositing a first material on the surface of a metal substrate to form a seed layer of the first material, the first material being deposited under reducing conditions relative to the metal substrate, and then epitaxially depositing a second material on a surface of the seed layer, wherein the second material is deposited from a solution-based precursor under second conditions that are more oxidizing than the reducing conditions used in the deposition of the first material.
A method of making a multilayer article, comprising:
A method of making a multilayer article, comprising:
Dependencies are inferred from the claim text.