System and method for hermetically sealing a package
AssigneeHewlett-Packard Development Company, L.P.
InventorsDon Michael, Mari Rossman
Life of this patent
Estimating the term…
Abstract
A method for hermetically sealing a package includes applying a light or energy active resist to a fill port to act as a temporary hermetic seal, patterning the resist, and applying a solder to the fill port, wherein the solder is configured to serve as a hermetic seal.
Claims61
A method for hermetically sealing a package comprising:
- applying a light or energy active resist to a fill port, said resist acting as a temporary hermetic seal;
- patterning said resist;
- and
- applying a solder to said fill port;
- wherein said solder is configured to serve as a hermetic seal.
A method for temporarily sealing an integrated circuit (IC) package comprising applying a light or energy active resist to a fill port, said resist temporarily sealing said package.
A method for hermetically sealing a Micro-Electro Mechanical System (MEMS) package or a micro-electro-optical mechanical system (MEOMS) package comprising:
- applying a light or energy active resist to a fill port of said package, said resist acting as a temporary hermetic seal;
- patterning said resist;
- and
- applying a solder to said fill port;
- wherein said solder is configured to serve as a hermetic seal.
An integrated circuit (IC) package, wherein said IC package was formed by:
- sealing a fill port with a light or energy active resist;
- patterning said resist;
- and
- hermetically sealing said fill port with a solder;
- wherein a portion of said resist remains in said IC package.
A system for hermetically sealing an integrated circuit (IC) package comprising:
- a resist dispenser;
- an energy source;
- a mask communicatively coupled to said energy source;
- a developer;
- a solder dispenser;
- and
- a solder reflow device;
- wherein said resist dispenser, said energy source, said mask, and said developer are configured to perform a photolithography process.
A system for hermetically sealing an integrated circuit (IC) package comprising:
- a means for applying a light or energy active resist to a fill port;
- a means for patterning said resist;
- a means for applying a solder to said fill port;
- and
- a means for re-flowing said solder;
- wherein said means for patterning said resist is configured to remove a sufficient quantity of said resist to facilitate the application of said solder to form a hermetic seal on said fill port.
A hermetically sealed package comprising:
- an inner enclosure;
- a fill port channel coupling said inner enclosure to an atmosphere;
- a quantity of resist disposed in said fill port channel;
- and
- a quantity of solder disposed in said fill port channel, wherein said quantity of solder hermetically seals said inner enclosure.
A hermetically sealed micro-electro mechanical system (MEMS) package comprising:
- an inner enclosure;
- a MEMS disposed in said inner enclosure;
- a fill port channel coupling said inner enclosure to an atmosphere;
- a quantity of resist disposed in said fill port channel;
- and
- a quantity of solder disposed in said fill port channel, wherein said quantity of solder hermetically seals said inner enclosure.
A hermetically sealed package comprising:
- a means for enclosing an integrated circuit or a MEMS;
- a means for channeling a fluid into said means for enclosing;
- a quantity of resist disposed in said means for channeling;
- and
- a means for hermetically sealing a channel disposed in said means for channeling, wherein said means for hermetically sealing hermetically seals said means for enclosing.
Dependencies are inferred from the claim text.