Optoelectronic components with multi-layer feedthrough structure
AssigneeFinisar Corporation
InventorsDev Kumar, Stefano Schiaffino, Giorgio Giaretta
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Abstract
This disclosure concerns a platform suitable for use in connection with optoelectronic components and devices. In one example, the platform includes multiple stacked platform layers. A conductive pathway of the platform is supported by at least one of the stacked platform layers, and the conductive pathway is configured and arranged so as to be at least partly coextensive with the platform.
Claims60
A header assembly suitable for use in connection with optoelectronic components and comprising:
- a base;
- and
- a platform extending through the base and including a plurality of stacked layers and at least one conductive pathway, the at least one conductive pathway being at least partially coextensive with the platform.
An optical subassembly comprising:
- a header assembly comprising:
- a base;
- and
- a platform extending through the base and including a plurality of stacked platform layers and at least one conductive pathway, the at least one conductive pathway configured and arranged so as to extend through the base;
- and
- at least one optoelectronic component mounted at least indirectly to the platform of the header assembly.
An optical transceiver, comprising:
- a housing;
- a printed circuit board including circuitry and substantially disposed within the housing;
- a pair of optical subassemblies substantially disposed within the housing, at least one of the optical subassemblies comprising:
- a header assembly comprising:
- a base;
- and
- a platform extending through the base and including a plurality of stacked layers and at least one conductive pathway, the at least one conductive pathway configured and arranged so as to extend through the base;
- and
- at least one optoelectronic component mounted at least indirectly to the platform of the header assembly;
- and
- a flex circuit electrically connecting the optical subassemblies with the circuitry of the printed circuit board.
A platform suitable for use in connection with optoelectronic components and devices, the platform comprising:
- a plurality of stacked layers;
- and
- at least one conductive pathway supported by at least one of the stacked layers, the at least one conductive pathway configured and arranged so as to be at least partially coextensive with the platform.
Dependencies are inferred from the claim text.