Electronic component and panel and method for the production thereof
AssigneeInfineon Technologies AG
InventorsStephan Blaszczak, Martin Reiss
Life of this patent
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Abstract
The invention relates to an electronic component and a panel, the electronic component having a semiconductor chip with a wiring board and a plastic package. The plastic package is made up of two layers of plastic package molding compound arranged one on top of the other. These layers are created with the aid of a printing operation under normal atmosphere.
Claims21
1-12. (canceled)
An electronic component comprising:
- a semiconductor chip having edge regions and a back side;
- a wiring board;
- and
- a plastic package having first and second plastic package molding compounds arranged one on top of the other, wherein the first plastic package molding compound completely encloses at least the edge regions of the semiconductor chip as a first layer and the second plastic package molding compound is arranged on the back side of the semiconductor chip as a second layer.
A panel with a number of component positions for electronic components comprising:
- a leadframe which has in each component position a bonding channel opening that is filled with a plastic covering compound;
- and
- a number of semiconductor chips each with back sides and with intermediate spaces between them, wherein the intermediate spaces are filled with a first layer of plastic package molding compound and the back sides are covered with a second layer of plastic package molding compound.
A method for producing a panel from a leadframe for a number of electronic components in corresponding component positions with semiconductor chips, which are encapsulated by two layers of a plastic package molding compound, comprising:
- providing a leadframe with a number of component positions that have a bonding channel opening at their center;
- applying a double-sided adhesive film with a bonding channel opening in the component positions;
- applying semiconductor chips with their active upper sides to the double-sided adhesive film;
- introducing bonding connections in every bonding channel for electrically connecting contact areas of the semiconductor chip to external contacts on an underside of the leadframe;
- filling the bonding channel with a plastic covering compound;
- printing a first layer of low-viscosity plastic package molding compound onto back sides of the semiconductor chips for filling intermediate spaces between semiconductor chips on the leadframe;
- printing on a second layer of high-viscosity plastic package molding compound for covering the back sides of the semiconductor chips;
- curing the plastic package molding compound to form a closed upper side of the panel;
- and
- applying external contacts to an underside of the panel.
Dependencies are inferred from the claim text.