Back to results
US 2005/0087759 A1Published application
System and method for surface reduction, passivation, corrosion prevention and activation of copper surface
AssigneeLam Research Corporation
InventorsAndrew Bailey, Shrikant Lohokare
Life of this patent
Estimating the term…
Abstract
A system and method of passivating an exposed conductive material includes placing a substrate in a process chamber and injecting a hydrogen species into the process chamber. A hydrogen species plasma is formed in the process chamber. A surface layer species is reduced from a top surface of the substrate is reduced. The reduced surface layer species are purged from the process chamber.
Claims23
A method of passivating an exposed conductive material comprising:
- placing a substrate in a process chamber;
- injecting a hydrogen species into the process chamber;
- forming a hydrogen species plasma in the process chamber;
- reducing a surface layer species from a top surface of the substrate;
- and
- purging the reduced surface layer species from the process chamber.
3 more elements
A method of passivating an exposed copper interconnect comprising:
- placing a substrate in a process chamber;
- injecting a hydrogen species into the process chamber;
- forming a hydrogen species plasma in the process chamber;
- reducing a copper oxide from a top surface of the exposed copper interconnect;
- and
- purging the reduced copper oxide from the process chamber.
3 more elements
A method of performing a non-contact planarization on a substrate comprising:
- placing a substrate in an etch process chamber;
- etching the substrate;
- injecting a hydrogen species into the etch process chamber;
- forming a hydrogen species plasma in the etch process chamber;
- reducing a surface layer species from a top surface of the substrate;
- and
- purging the reduced surface layer species from the process chamber.
4 more elements
Dependencies are inferred from the claim text.