US 2005/0087743 A1 · Semiconductor device, LED print head and image-forming apparatus using same, and method of manufacturing semiconductor device

Abstract

In a method of manufacturing a semiconductor thin film piece device, a plurality of semiconductor thin film pieces (14) are selected from among the semiconductor thin film pieces (14) formed on a first substrate (35), and bonded to a first set of predetermined area on a second substrate (12). Subsequently, a plurality of semiconductor thin film pieces are selected from the remaining semiconductor thin film pieces (14), and bonded to a second set of predetermined area.

Claims22

Dependent claims

A semiconductor device formed by bonding a semiconductor thin film piece formed on a first substrate and having a semiconductor element, to a second substrate, wherein the width of said semiconductor thin film piece is less than the chip width of said semiconductor device.

Dependencies are inferred from the claim text.

Facts

Application

10/970,637Filed 21 Oct 2004

Priority

JP 2003-36151222 Oct 2003

Published

28 Apr 2005

Term ends

Not estimatedThe source records don’t support an estimate.

Classification12 codes

H10W 90/00
Package configurations
B41J 2/45
Using arrays of radiation sources: using light-emitting diode [LED] or laser arrays
H10P 72/74
For supporting or gripping: using temporarily an auxiliary support
H10H 20/018
Of bodies, e.g. forming semiconductor layers: bonding of wafers

Semiconductor device, LED print head and image-forming apparatus using same, and method of manufacturing semiconductor device

Life of this patent

Semiconductor device, LED print head and image-forming apparatus using same, and method of manufacturing semiconductor device

Life of this patent

Abstract

Claims22