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US 2005/0087679 A1Published application
Superposed multi-junction color APS
AssigneeMicron Technology, Inc.
InventorVladimir Berezin
Life of this patent
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Abstract
A CMOS image sensor obtains color through the use of two or three superposed layers. Each pixel in the image sensor includes a plurality of superposed photosensitive p-n junctions with individual charge integration regions. The combination of each of the superposed layers provides increased sensitivity and resolution of a single chip color imager.
Claims23
1-33. (canceled)
A device, comprising:
- a semiconductor substrate, with a top surface;
- and
- a pixel formed in the semiconductor substrate and comprising:
- first, second and third photoreceptor parts, located within said semiconductor substrate in locations where each of said first, second and third photoreceptor parts receive radiation having different spectral characteristics and, in response, said parts collect charges during respective first, second, and third integration periods, said charges indicative of the received radiation.
1 more element
A pixel cell, comprising:
- a first photoreceptor part, sensitive primarily to a first primary color, and in a first layer of a substrate;
- and
- a second photoreceptor part, sensitive primarily to a second primary color different than said first primary color, and located in a second layer of said substrate which is superimposed relative to said first layer, wherein each of said first and second photoreceptor parts has an associated first and second individually controlled storage region for respectively collecting charges formed in said parts in response to applied light.
Dependencies are inferred from the claim text.