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US 2005/0087301 A1Published application
Apparatus for processing substrate and method of doing the same
AssigneeNEC LCD Technologies, Ltd.
InventorShusaku Kido
Life of this patent
Estimating the term…
Abstract
The apparatus for processing a substrate includes a substrate carrier for carrying a substrate, a chemical-applying unit for applying chemical to the substrate, and a gas-applying unit for applying gas atmosphere to the substrate.
Claims134
An apparatus for processing a substrate, comprising:
- a substrate carrier for carrying a substrate;
- a chemical-applying unit for applying chemical to said substrate;
- and
- a gas-applying unit for applying gas atmosphere to said substrate.
1 more element
An apparatus for processing a substrate, comprising:
- a substrate carrier for carrying a substrate;
- a temperature-control unit for controlling a temperature of said substrate;
- and
- a gas-applying unit for applying gas atmosphere to said substrate.
1 more element
An apparatus for processing a substrate, comprising:
- a substrate carrier for carrying a substrate;
- and
- a gas-applying unit for applying gas atmosphere to said substrate,
- wherein said gas-applying unit includes a temperature controller which keeps said substrate at 15 to 40 degrees centigrade both inclusive.
1 more element
An apparatus for processing a substrate, comprising:
- a substrate carrier for carrying a substrate;
- a temperature-control unit for controlling a temperature of said substrate;
- and
- a gas-applying unit for applying gas atmosphere to said substrate, wherein said gas-applying unit includes a temperature controller which keeps said substrate at 10 to 50 degrees centigrade both inclusive.
1 more element
An apparatus for processing a substrate, comprising:
- a substrate carrier for carrying a substrate;
- a temperature-control unit for controlling a temperature of said substrate;
- and
- a gas-applying unit for applying gas atmosphere to said substrate,
- wherein said gas-applying unit includes a temperature controller which keeps said substrate at a target temperature within ±2 degrees, said target temperature being in the range of 10 to 50 degrees centigrade both inclusive.
2 more elements
An apparatus for processing a substrate, comprising:
- a substrate carrier for carrying a substrate;
- a temperature-control unit for controlling a temperature of said substrate;
- and
- a gas-applying unit for applying gas atmosphere to said substrate,
- wherein said temperature-control unit keeps said substrate at 15 to 40 degrees centigrade both inclusive.
2 more elements
An apparatus for processing a substrate, comprising:
- a substrate carrier for carrying a substrate;
- a temperature-control unit for controlling a temperature of said substrate;
- and
- a gas-applying unit for applying gas atmosphere to said substrate,
- wherein said temperature-control unit keeps said substrate at 10 to 50 degrees centigrade both inclusive.
2 more elements
An apparatus for processing a substrate, comprising:
- a substrate carrier for carrying a substrate;
- a temperature-control unit for controlling a temperature of said substrate;
- and
- a gas-applying unit for applying gas atmosphere to said substrate,
- wherein said temperature-control unit keeps said substrate at a target temperature within ±2 degrees, said target temperature being in the range of 10 to 50 degrees centigrade both inclusive.
2 more elements
An apparatus for processing a substrate, comprising:
- a substrate carrier for carrying a substrate;
- a temperature-control unit for controlling a temperature of said substrate;
- and
- a gas-applying unit for applying gas atmosphere to said substrate,
- wherein each of said temperature-control unit and said gas-applying unit includes a temperature controller which keeps said substrate at 10 to 50 degrees centigrade both inclusive.
2 more elements
An apparatus for processing a substrate, comprising:
- a substrate carrier for carrying a substrate;
- a temperature-control unit for controlling a temperature of said substrate;
- and
- a gas-applying unit for applying gas atmosphere to said substrate,
- wherein each of said temperature-control unit and said gas-applying unit includes a temperature controller which keeps said substrate at a target temperature within ±2 degrees, said target temperature being in the range of 10 to 50 degrees centigrade both inclusive.
2 more elements
An apparatus for processing a substrate, comprising:
- a substrate carrier for carrying a substrate;
- a temperature-control unit for controlling a temperature of said substrate;
- and
- a gas-applying unit for applying gas atmosphere to said substrate,
- wherein each of said temperature-control unit and said gas-applying unit includes a temperature controller which keeps said substrate at 10 to 50 degrees centigrade both inclusive, and
- temperature controllers of said temperature-control unit and said gas-applying unit have target temperatures at which said substrate is kept, said target temperatures being identical with each other or being within ±5 degrees to each other.
3 more elements
An apparatus for processing a substrate, comprising:
- a substrate carrier for carrying a substrate;
- a temperature-control unit for controlling a temperature of said substrate;
- and
- a gas-applying unit for applying gas atmosphere to said substrate,
- wherein each of said temperature-control unit and said gas-applying unit includes a temperature controller which keeps said substrate at a target temperature within ±2 degrees, said target temperature being in the range of 10 to 50 degrees centigrade both inclusive, and temperature controllers of said temperature-control unit and said gas-applying unit have target temperatures at which said substrate is kept, said target temperatures being identical with each other or being within ±5 degrees to each other.
2 more elements
Dependencies are inferred from the claim text.