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US 2005/0037543 A1Published application
Method of manufacturing heat conductive substrate
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsTetsuya Tsumura, Shinya Tanaka, Michihiro Miyauchi, Hisatoshi Atsumo, Yoshiyuki Miyoshi
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Abstract
The present invention offers a method of manufacturing a heat conductive substrate, with which substrate contamination on the surface of lead frame due to oozing or push out of thermosetting resin composite during heat-pressurization is suppressed. The oozing or push out of thermosetting resin composite from the through hole of lead frame can be prevented by a film attached on the components mounting surface of lead frame.
Claims20
A method of manufacturing heat conductive substrate comprising the steps of
- forming a conductive circuit element by processing a metal sheet to a certain specific pattern,
- attaching a film on the components mounting surface of the conductive circuit element,
- providing in advance an integrated body of sheet-formed flexible thermosetting resin composite and a heat dissipation plate, and forming a laminated member by laminating the integrated body on the conductive circuit element so that the thermosetting resin composite side makes contact with the conductive circuit element at the surface reverse to components mounting surface,
- and then, heat-pressing the laminated member so that a through hole provided in the conductive circuit element is filled with the thermosetting composite, and the laminated member is brought into an integrated body by turning the thermosetting composite to a half-cured state,
- completely curing the thermosetting composite contained in the laminated member, and
- peeling the film off the laminated member in a half-cured state or completely cured state.
3 more elements
A method of manufacturing heat conductive substrate comprising the steps of
- forming a conductive circuit element by processing a metal sheet to a certain specific pattern,
- attaching a film on the components mounting surface of the conductive circuit element,
- forming a laminated member by laminating a sheet-formed flexible thermosetting resin composite and a heat dissipation plate in the order on the conductive circuit element at the surface reverse to components mounting surface,
- and then, heat-pressing the laminated member so that a through hole provided in the conductive circuit element is filled with the thermosetting composite, and the laminated member is brought into an integrated body by turning the thermosetting composite to a half-cured state,
- completely curing the thermosetting composite contained in the laminated member, and
- peeling the film off the laminated member in a half-cured state or completely cured state.
3 more elements
A method of manufacturing heat conductive substrate comprising the steps of
- forming a conductive circuit element containing an electrically isolated land portion and a connecting portion connecting the land portion by processing a metal sheet to a certain specific pattern,
- attaching a first film to the conductive circuit element at the surface reverse to components mounting surface,
- removing the first film at the connecting portion and the corresponding location,
- attaching a second film on the components mounting surface of conductive circuit element and then peeling the first film attached at the reverse surface off,
- providing in advance an integrated body of sheet-formed flexible thermosetting resin composite and a heat dissipation plate, and forming a laminated member by laminating the integrated body on the conductive circuit element so that the thermosetting resin composite side makes contact with the conductive circuit element at the surface reverse to components mounting surface,
- and then, heat-pressing the laminated member so that a through hole provided in the conductive circuit element is filled with the thermosetting composite, and the laminated member is brought into an integrated body by turning the thermosetting composite to a half-cured state,
- completely curing the thermosetting composite contained in the laminated member, and
- peeling the second film off the laminated member in a half-cured state or completely cured state.
5 more elements
A method of manufacturing heat conductive substrate comprising the steps of
- forming a conductive circuit element containing an electrically isolated land portion and a connecting portion connecting the land portion by processing a metal sheet to a certain specific pattern,
- attaching a first film to the conductive circuit element at the surface reverse to components mounting surface,
- removing the first film at the connecting portion and the corresponding location,
- attaching a second film on the components mounting surface of conductive circuit element and then peeling the first film attached at the reverse surface off,
- forming a laminated member by laminating a sheet-formed flexible thermosetting composite and a heat dissipation plate in the order on the conductive circuit element at the surface reverse to components mounting surface,
- and then, heat-pressing the laminated member so that a through hole provided in the conductive circuit element is filled with the thermosetting composite, and the laminated member is brought into an integrated body by turning the thermosetting composite to a half-cured state,
- completely curing the thermosetting composite contained in the laminated member, and
- peeling the second film off the laminated member in a half-cured state or completely cured state.
5 more elements
Dependencies are inferred from the claim text.