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US 2005/0032938 A1Published application
Epoxy compositions
OwnerTheodore Flint, Irvin Crossaninventors
Life of this patent
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Abstract
The present invention relates to a non-sensitizing epoxy composition including an uncured epoxy resin composition including a liquid epoxy resin and a non-sensitizing mercaptan composition capable of curing said epoxy resin when combined with said mercaptan composition to form a substantially uniform mixture, wherein said epoxy resin has a molecular weight greater than about 700.
Claims17
A non-sensitizing epoxy composition comprising:
- an uncured epoxy resin composition including a liquid epoxy resin and a non-sensitizing mercaptan composition capable of curing said epoxy resin when combined with said mercaptan composition to form a substantially uniform mixture, wherein said epoxy resin has a molecular weight greater than about 700.
A non-sensitizing epoxy composition comprising:
- a first band of an uncured epoxy resin composition including a liquid epoxy resin and a second band, said bands being joined in close side-by-side relation throughout their entire length, said second band comprising a non-sensitizing mercaptan composition capable of curing said epoxy resin when said first and second bands are combined to form a substantially uniform mixture, wherein said epoxy resin has a molecular weight greater than about 700.
A method of forming a non-sensitizing epoxy putty composition, comprising:
- combining an uncured epoxy resin composition including a liquid epoxy resin and a non-sensitizing mercaptan composition capable of curing said epoxy resin when combined with said mercaptan composition to form a substantially uniform mixture, wherein said epoxy resin has a molecular weight greater than about 700.
Dependencies are inferred from the claim text.